SMT surface mount technology and services provided by BEON
A lot of people wonder,how are these components smaller than ants on the circuit board soldered?
Today let us uncover its mystery.
Components as small as ants
Before soldering, the circuit board must first be sent to a fully automatic solder paste printing machine, through the steel mesh, to accurately brush the solder paste on the large and small pads on the PCB for subsequent brazing. In the soldering process, 80% of defects come from poor solder paste printing.
automatic solder paste printing machine
Our solution: Use 3D Solder Paste Inspection (SPI) equipment to produce a set of 3D images for each pad to control printing defects to the greatest extent.
3D Solder Paste Inspection (SPI) AOI system to perform optical inspect
The next step is the key step. Under the full speed operation, the placement machine can paste the tiny components on the pads at an astonishing speed of 45,000 points per hour. Then, through reflow soldering, the solder is melted with high-temperature hot air, and the tin is completely fused with the components after cooling.
SMT machine
For pin components, wave soldering is the choice. The wave peak formed by high-temperature liquid tin is in contact with the pins, which looks very decompressed. After all the welding is completed, we also need to use the AOI system to perform optical inspection on hundreds of thousands of solder joints on the surface.
wave-soldering
For the solder joints that cannot be seen inside the circuit board, we change the ray, relying on automatic X-ray detection technology, we can even perform qualitative and quantitative analysis on the detection results, so that the fault can be hidden.
X-ray detection technology
Foshan Shunde Beon Electric Co., Ltd.
